Challenges For 90nm Design
HEADQUARTERS
8TH FL., No. 88, Sec. 1, Nei Hu Rd., Taipei 114, Taiwan, R.O.C.
台北市114內湖路一段88號8樓
TEL: 02-2658-2233
FAX: 02-2658-0915
Progate Group USA Corporation
1
590 Oakland Road, Suite B204, San Jose CA95131, USA
TEL:(408)437-5758
FAX:(408)437-5760
MPW Shuttle Bus Service
MPW Overview
MPW Service Programs
MPW Turnkey Service Flow
MPW Turnkey Service Cycle Time
Benefits
Success Cases
MPW Shuttle Bus Schedule
Customer Request Form
SOC / ASIC Request Form
Gate Array Request Form
MPW Request Form
Layout Service Request Form
COT Request Form
ASIC Product Turnkey Service
ASIC Product Turnkey Service
SOC/ASIC Turnkey Capability
SOC/ASIC Turnkey Equipment
Turnkey Background
Reliability Test
Failure Analysis
Package Offerings
About PGC
Company Profile(1)
Company Profile(2)
Business Principles
Company Organization
Sales Revenue
Roadmap
Location
PGC Market Position
Why PGC
Employment
人力資源
公司簡介
公司產品
鏈結104網站
SOC-IP
Coming Soon IP
Digital IP
Mixed Signal
Emb-Memory IP
Cell & Memory Compiler IP
Flash IP
Special I/O
Gate Array
Gate Array Design Turnkey Service
0.35um HDA10000
0.5um HDA9000
0.6um HDA8000
0.6um TGT550
G/A Design Sign-off Flow
FPGA->Gate Array conversion
FPGA Converting and Verifying Flow
SOC / ASIC Design Turnkey Service
SOC Design Turnkey Service
Fault Simulation / Coverage Service Flow
SOC RTL Hand-off Flow(SOC RTL-QA)
Memory BIST Service Flow
SOC RTL-QA Analysis Flow Overview
SOC Low Power Service Flow
SOC Design Platform Service (RTLQA, STA, DFT and Low Power)
FIB Overview
SOC Design Platform Service Flow (Between PGC and Customer)
FIB Flow
Pre-Layout Sign-off Flow
ASIC Design Turnkey Service Memo
Post-Layout Sign-off Flow
PGC ASIC Design Turnkey Service Process Schedule
SOC DFT and ATPG Service Flow
Mass Production Control Flow
Boundary Scan Service Flow
Package Offerings
Success Cases
90nm
0.13um
0.18um
0.25um
0.35um
0.5um
0.6um
SiP Design Turnkey Service
SyStem-in-Package (SiP)
SiP Design Platform Service
SiP Punch Type Offering
SiP versus SOC
SiP Package
SiP Design Information
SiP Package Size
SiP Punch Type Offering
SiP Sawing Type Offering
SiP Developing Time
SiP Developing Flow
SiP Developing Design Fee
Electrical Simulation
Thermal Simulation
MCM QFP Stacked Die
SiP Side by Side
SiP Stacked(1) BGA
SiP Stacked(2) BGA
Package Stacking Package
SiP RF Package
