Business Model (ASIC Service Model)
ASIC Turnkey Service
  ASIC Technology:
12"(nm): 5nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, Others
8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others
ASIC Implementation Platform Service:
  Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII-in, Chip(Performance, Low Power, Area, Cost), IR Drop, Synthesis, STA, Signal Integrity, APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair
MPW / CyberShuttle Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
MLM (Multi-Layer Mask) Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service
  ARM-based Platform¡FAndes-base Platform, Others
IP (Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service:
  PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory¡FCustomized IP, Modify, CPU Hardening
APR Layout Service (ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) Turnkey Service
ASIC Product Turnkey Service (PGC + TSMC + ASE):
  Testing Program Development(Credence D10, Chroma 3650, Teradyne J750EX, Others), Logistic, WIP, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run