DESIGN SERVICE & TURNKEY (BUSINESS MODEL)
SOC / ASIC Turnkey Service
  Technology: 16nm, 20nm, 28nm, 40nm, 65nm, 90nm, 0.11um, 0.13um, 0.18um, 0.25um, 0.35um, 0.5um, 0.6um
SOC Implementation Platform Service:
  Spec-in, RTL to CHIP, Netlist to CHIP, GDSII in, IR Drop, Synthesis, STA, Signal Integrity, LAYOUT, Low Power Design, DFT, ATPG, BSD, Mem_BIST, Power Analysis(RTL, Netlist, Package)
MPW (Multi-Project Wafer) Shuttle Bus Service
GATE ARRAY Turnkey Service
Structured ASIC Turnkey Service
MLM (Multi-Layer Mask) Turnkey Service
Platform ASIC Turnkey Service
  ARM-based Platform¡FAndes-base Platform
IP (Special I/O, Mixed Signal, High Density Memory, Flash...) Design Service:
  PLL, Special I/O, ADC & DAC, High Density Memory¡FCustomized, Modify, Athoring
APR Layout Service
COT (GDSII TO CHIP) Turnkey Service
SiP(System-in-Package) Turnkey Service
SOC / ASIC Product Turnkey Service (PGC + TSMC + ASE):
  Testing Program Development(Chroma 3650(J750), Credence D-10), Logistic, WIP, Tape-out, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run