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| SOC / ASIC Design Turnkey Service | |
| Technology: 65nm, 90nm, 0.13um, 0.18um, 0.25um, 0.35um, 0.5um | |
| SOC Implementation Platform Service: | |
| Spec-in, Project-in, RTL to CHIP, Netlist to CHIP, RTL QA, STA, Signal Integrity, LAYOUT, Low Power Design, DFT, ATPG, BSD, Mem_BIST, Power Analysis(RTL, Netlist, Package) | |
| SiP Design Turnkey Service | |
| Platform ASIC Design Turnkey Service | |
| ARM-based Platform;Gate Array Platform;Structured ASIC Platform | |
| IP(Special I/O, Mixed Signal, High Density Memory...) Design Service: | |
| Special I/O, ADC & DAC, High Density Memory;Customized, Modify, Athoring | |
| GATE ARRAY(Mask/Metal Type FPGA) Design Turnkey Service | |
| FPGA To ASIC(ASIC To ASIC) Design Turnkey Sercivce | |
| Structured ASIC IP(Platform ASIC) Design Turnkey Service | |
| LAYOUT(APR, Full custom, Shrinking) Design Service | |
| COT(GDSII TO CHIP) Turnkey Service | |
| MPW (Multi-Project Wafer) Shuttle Bus Service | |
| SOC / ASIC Product Turnkey Service(PGC + TSMC + ASE): | |
| Testing Program Development(Agilent 93000, HILEVEL, Credence Sapphire D-10), Logistic, WIP, Tape-out, Package, Testing, Yield Improvement, Corner Run, Failure Analysis, Reliability, Wafer Allocation | |
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