Untitled Document

PGC Turnkey Design Service Reference Flow
For 40/65nm process

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SiP Turnkey Design Service

SyStem-in-Package (SiP)	SiP Design Platform Service
SiP Punch Type Offering	SiP versus SOC
SiP Package	SiP Design Information
SiP Package Size	SiP Punch Type Offering
SiP Sawing Type Offering	SiP Developing Time
SiP Developing Flow	SiP Developing Design Fee
SiP Developing Flow	SiP Developing Design Fee
Electrical Simulation	Thermal Simulation
MCM QFP Stacked Die	SiP Side by Side
SiP Stacked(1) BGA	SiP Stacked(2) BGA
Package Stacking Package	SiP RF Package

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SOC-IP

Cell & Memory Compiler IP

SOC / ASIC Turnkey Design Service

SOC Turnkey Design Service	Fault Simulation / Coverage Service Flow
SOC RTL Hand-off Flow(SOC RTL-QA)	Memory BIST Service Flow
SOC RTL-QA Analysis Flow Overview	SOC Low Power Service Flow
SOC Design Platform Service (RTLQA, STA, DFT and Low Power)	FIB Overview
SOC Design Platform Service Flow (Between PGC and Customer)	FIB Flow
Pre-Layout Sign-off Flow	ASIC Turnkey Design Service Memo
Pre-Layout Sign-off Flow	ASIC Turnkey Design Service Memo
Post-Layout Sign-off Flow	PGC ASIC Turnkey Design Service Process Schedule
SOC DFT and ATPG Service Flow	Mass Production Control Flow
Boundary Scan Service Flow	Package Offerings

Gate Array Turnkey Design Service

0.35um HDA10000

G/A Design Sign-off Flow

FPGA->Gate Array conversion

FPGA Converting and Verifying Flow