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Corporate Overview

PGC (Progate Group Corporation) was founded in 1991. PGC is a certified member of TSMC Design Center Alliance (DCA) ASIC Service Partner. Headquarters is located in Neihu Technology Park Taipei(Taiwan). PGC taped-out successfully more than 1000 projects at TSMC and produced several hundred million ICs in 30 years. PGC shipped IC products to hundreds of customers in Europe, USA, Japan, Israel, Russia, Korea, Singapore, Vietnam, China and Taiwan. PGC continues making efforts to research and development of ASIC/SoC/IP Platform which is an innovative ASIC design turnkey provider. PGC also cooperate with TSMC¡¦s partner VIS in long-term relationship to provide a variety of IP solutions to fulfill the diversified demands of customer targeted applications and promote competitive advantage of customer¡¦s product. PGC provides Synopsys (ICC2) IC design turnkey service for TSMC 5nm. PGC is a value-added ASIC turnkey service provider for all customers in advanced technologies.

The applications include 3C products, Industrial Automatic Control, Aerospace, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, CPU, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor, Edge Server, Analog, SiP, Chiplets, High Voltage, ARM, USB, Electric Vehicle, BCD, 3D Package, etc. PGC establish long-term and stable cooperative relationship with many IP companies worldwide, therefore PGC has accumulated a lot of experiences in IP usage, integration and verification, also offers IP customization for customers. For design service, PGC offers SoC platforms of ARM-core or ANDES-core with peripheral IPs and high-speed interfaces, RTL coding and system integration. Synopsys (ICC2) IC design service flow for TSMC 5nm is fully integrated in PGC design environment.The major testers for turnkey testing solution and service of PGC are Credence D10, Chroma 3650 and Teradyne J750EX, etc. The turnkey testing solution and service includes testing program development service, chip probing service and IC final testing service at the engineering and mass production stage for customer.



Corporate Vision
World-leading Customized ASIC Turnkey Service



Core Value
Innovation¡BQuality¡BExcellence¡BSteadiness



Corporate Mission
1. Integrity
2. Customer Satisfaction
3. Trust
4. We are the ASIC team
5. Long-term Partnership
6. Excellent Quality
7. Evolution
8. Innovative Value
9. High C/P Value
10. On Demand Service
11. Long-term Turnkey
12. Cost-effective



Corporate Background
CEO: Fred Lai
Headquarters: 8F., No. 88, Sec. 1, Neihu Rd., Neihu Dist., Taipei City 114, Taiwan(Taipei Neihu Technology Park)
Founded: Aug. 15, 1991
Business Model: ASIC Turnkey Service
Business Partners in Japan, Israel, Russia, China, USA
Success Story: Successful projects more than 1000 taped-out at TSMC (since 1991)
Worldwide Customers: Europe, Germany, France, USA, Japan, Israel, Russia, Korea, Singapore,
  Vietnam, China and Taiwan, etc.



Business Model
ASIC Turnkey Service
ASIC Technology:
12"(nm): 5nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 110nm, 130nm, Others
8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others

ASIC Implementation Platform Service
Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII-in, Chip(Performance, Low Power, Area, Cost), IR Drop, Synthesis, STA, Signal Integrity,
APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair

MPW / CyberShuttle Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
MLM (Multi-Layer Mask) Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service
ARM-based Platform; Andes-base Platform, Others
IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service
PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory¡FCustomized IP, Modify, CPU Hardening
APR Layout Service(ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) / 3D Package Turnkey Service
ASIC Product Turnkey Service(PGC + TSMC + ASE)
Testing Program Development(Credence D10, Chroma 3650, Teradyne J750EX, Others), Logistic, WIP, CP, FT, MP, Package,
Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run, Special Run



TSMC Recommend IP Alliance Program And IP Ecosystem Partners
CPU IP : ARM, ANDES, Others
Digital IP : ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4,
8051, 6502, 16-bits MCU, 32-bits MCU, Others

Mixed Signal IP : ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator, Others
High Speed Interface PHY : USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes, Others
Special I/O IP : I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator, Others
Memory IP : SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM, Others
Analog IP : LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD), Others
Customized IP (On Demand) :
¡@Clocking : PLL, DLL, OSC, De-skew...
¡@ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope
¡@DAC : Current-mode, Voltage-mode
¡@AFE : PGA, Filter, CDS
¡@Others : LDO, LVDS, POR, VDT, Special I/O, High Speed Interface I/O, etc.



Award / Certification
The 9th Taiwan Outstanding Small & Medium Enterprises Award, Taiwan (Year 2000)
TSMC: TSMC DCA (Design Center Alliance) strategy partner
VIS: VIS IC design service strategy partner
GUC: Long-term Strategy partnership
Artisan: Silicon Artist Design Center Gold Program
ARM Limited: ARM Technology Access Program(ATAP)
  Approved Design Center
ANDES: Long-term Strategy partnership
ememory: Long-term Strategy partnership
M31: Long-term Strategy partnership
HDMI: HDMI Adopter Certified
ASE: Long-term business relationship for chip package
GTK: Long-term business relationship for chip package
ISO: ISO9001, QC080000