Corporate Overview

PGC (Progate Group Corporation) was founded in 1991. Headquarters is located in Neihu Technology Park Taipei(Taiwan). Being the innovative ASIC turnkey service provider in Taiwan, PGC is a member of TSMC Design Center Alliance (DCA) ASIC Service Partner. PGC taped-out successfully more than 1000 projects and produced several hundred million ICs in 28 years. These ICs were shipped to hundreds of customers in Europe, USA, Japan, Israel, Russia, Korea, Singapore, China and Taiwan. The applications include 3C products, Industrial Automatic Control, Aerospace, POS, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, Bitcoin Mining, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor…etc. PGC establish long-term and stable cooperative relationship with many IP companies worldwide, therefore PGC has accumulated a lot of experiences in IP usage, integration and verification, also offers IP customization for customers. For design service, PGC offers SoC platforms of ARM-core or ANDES-core with peripheral IPs and high-speed interfaces, RTL coding and system integration. Synopsys (ICC2) IC design service flow for TSMC 7nm is fully integrated in PGC design environment.
The major testers for turnkey testing solution and service of PGC are Advantest V93000, Teradyne J750EX, Credence D10 and Chroma 3650...etc. The turnkey testing solution and service includes testing program development service, chip probing service and IC final testing service at the engineering and mass production stage for customer.
PGC continues making efforts to research and development of ASIC/SoC/Platform. PGC provides Synopsys (ICC2) IC design turnkey service for TSMC 7nm. PGC is a turnkey service provider for all customers who are looking for value-adding partner in advanced technologies.

Corporate Vision
World-leading Customized SoC Turnkey Service

Core Value
Innovation、Quality、Excellence、Steadiness

Corporate Mission

1.	Integrity
2.	Customer Satisfaction
3.	Trust
4.	We are a team
5.	Long-term Partnership
6.	Excellent Quality
7.	Evolution
8.	Innovative Value
9.	High C/P Value
10.	On Demand
11.	Long-term Turnkey

Corporate Background

CEO:	Fred Lai
Headquarters:	8thFL., No.88, Sec.1, Neihu Rd., Taipei, Taiwan　(Neihu Technology Park)
Founded:	Aug. 15, 1991
Business Model:	ASIC, SoC / IP, Gate Array, MPW, COT, Platform ASIC, MLM, APR Layout, SiP,
	SoC / ASIC Product Turnkey, DFT, Low Power Design, Reliability, FA service
Business Partners in Japan, Israel, Russia, China, USA
Success Story:	Successful projects more than 1000 taped-out (since 1991)
Worldwide Customers:	Europe, Germany, France, USA, Japan, Israel, Russia, Korea, Singapore, China and Taiwan, etc.

Business Model
SoC / ASIC Turnkey Service
ASIC Technology: 7nm, 12m, 16m, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 0.11μm, 0.13μm, 0.18μm, 0.25μm, 0.35μm, 0.5μm, Others
SoC Implementation Platform Service
Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII-in, Chip(Performance, Low Power, Area, Cost), IR Drop, Synthesis, STA, Signal Integrity,
APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, LVS, DRC, Verification
MPW (Multi-Project Wafer) Shuttle Bus Service
Gate Array / Embedded Array Turnkey Service
FPGA To ASIC Turnkey Service
MLM (Multi-Layer Mask) Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
Platform ASIC Turnkey Service
ARM-based Platform; Andes-base Platform
IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service
PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory；Customized, Modify
APR Layout Service
COT(GDSII TO CHIP) Turnkey Service
SiP(System-in-Package) Turnkey Service
SoC / ASIC Product Turnkey Service(PGC + TSMC + ASE)
Testing Program Development(Advantest V93000, Teradyne J750EX, Credence D10, Chroma 3650, Others), Logistic, WIP, Tape-out, CP, FT, MP, Package,
Testing, Yield Improvement, Corner Run, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run


TSMC Recommend IP Alliance Program And IP Ecosystem Partners
Digital IP : ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4,
8051, 6502, 16-bits MCU, 32-bits MCU
Mixed Signal IP : ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator
High Speed Interface PHY : USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes
Special IO IP : I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator
Memory IP : SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM
Analog IP : LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD)
Customized IP (On Demand) :
　Clocking : PLL, DLL, OSC, De-skew...
　ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope
　DAC : Current-mode, Voltage-mode
　Others : LDO, LVDS, POR, etc.

Award / Certification

The 9th National Outstanding Small & Medium Enterprises Award, Taiwan (Year 2000)
TSMC:	TSMC DCA (Design Center Alliance) strategy partner
VIS:	VIS IC design service strategy partner
GUC:	Long-term Strategy partnership
Artisan:	Silicon Artist Design Center Gold Program
ARM Limited:	ARM Technology Access Program(ATAP)
	Approved Design Center
ANDES:	Long-term Strategy partnership
ememory:	Long-term Strategy partnership
M31:	Long-term Strategy partnership
HDMI:	HDMI Adopter Certified
ASE:	Long-term business relationship for chip package
GTK:	Long-term business relationship for chip package
ISO:	ISO9001, QC080000