SUCCESS CASES

MPW Shuttle Bus Service MPW Overview MPW Service Programs MPW Turnkey Service Flow MPW Turnkey Service Cycle Time Benefits Success Cases MPW Shuttle Bus Schedule

Customer Request Form SOC / ASIC Request Form Gate Array Request Form MPW Request Form Layout Service Request Form COT Request Form

ASIC Product Turnkey Service ASIC Product Turnkey Service SOC/ASIC Turnkey Capability SOC/ASIC Turnkey Equipment Turnkey Background Reliability Test Failure Analysis Package Offerings

Success Cases 90nm 0.13um 0.18um 0.25um 0.35um 0.5um 0.6um

SiP Turnkey Design Service SyStem-in-Package (SiP) SiP Design Platform Service SiP Punch Type Offering SiP versus SOC SiP Package SiP Design Information SiP Package Size SiP Punch Type Offering SiP Sawing Type Offering SiP Developing Time SiP Developing Flow SiP Developing Design Fee Electrical Simulation Thermal Simulation MCM QFP Stacked Die SiP Side by Side SiP Stacked(1) BGA SiP Stacked(2) BGA Package Stacking Package SiP RF Package

Package: Flip Chip BGA 2601L

Layer: 4+2+4 Layers

Body Size:52.5x52.5x3.2(mm)

Ball Diameter:0.6 (mm)

Ball Pitch:1.0 (mm)

U1:SOC

U2:SOC

Application: Super computer

About PGC Company Profile(1) Company Profile(2) Business Principles Company Organization Sales Revenue Roadmap Location PGC Market Position Why PGC

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SOC-IP Coming Soon IP Digital IP Mixed Signal Emb-Memory IP Cell & Memory Compiler IP Flash IP Special I/O Gate Array

SOC / ASIC Turnkey Design Service SOC Turnkey Design Service Fault Simulation / Coverage Service Flow SOC RTL Hand-off Flow(SOC RTL-QA) Memory BIST Service Flow SOC RTL-QA Analysis Flow Overview SOC Low Power Service Flow SOC Design Platform Service (RTLQA, STA, DFT and Low Power) FIB Overview SOC Design Platform Service Flow (Between PGC and Customer) FIB Flow Pre-Layout Sign-off Flow ASIC Turnkey Design Service Memo Post-Layout Sign-off Flow PGC ASIC Turnkey Design Service Process Schedule SOC DFT and ATPG Service Flow Mass Production Control Flow Boundary Scan Service Flow Package Offerings

Gate Array Turnkey Design Service 0.35um HDA10000 0.5um HDA9000 0.6um HDA8000 0.6um TGT550 G/A Design Sign-off Flow FPGA->Gate Array conversion FPGA Converting and Verifying Flow