SOC/ASIC TURNKEY EQUIPMENT
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EQUIPMENT
Q'TY
 HARDWARE CONFIGURATION

SOC Tester　　　(Agilent 93000)
1
 Mixed Signal(ADC, DAC, PLL, Analog), Flash, RF, Memory, ATPG, Special I/O(LVDS, PECL, USB2.0, AGP, IEEE1394, I2C, SSTL2, ......)　　　　　　　　(Data rate: up to 600 MHZ) for SOC product.

SOC Tester　　　(Credence D10)
1
 Mixed Signal - 4ch AWG / 4ch Digitizer(Max 24bit resolution)
384 Digital Channel (Up to 768 digital pins)
16M vectors / 200Mbps Date rate.
Wafer Probe Station (C/P)
3
 UF200 – 2 sets; to provide 8", 6" wafer probing service.
UF3000 – 1 set; to provide 12", 8" wafer probing service.
VLSI Tester
9
 D-channel 512 pins / 4M memory / Data rate 50Mhz / Memory Test
With Mixed-Mode Testing
Baker
6

Max. temperature: 200o / Content: 250Kpcs
Package Handler (F/T)
10
1. QFP series / QFN series / LQFP series / TQFP series
2. TBGA / LBGA / BGA series: (7x7 mm)(42.5x42.5mm)
　CSP series: (7x7 mm)(15x15mm)
3. PLCC series: PLCC-28, 32, 44, 52, 68, 84
4. SOP series: SOP-16, 20, 24, 28, 32
5. DIP series: DIP-20, 24, 28, 48, 64
Vacuum Packing
2

Wafer, Chip / Die, Package
Lead Scan (ICOS)
1

QFP / LQFP / TQFP / TBGA / LBGA / BGA / CSP...Series
Temperature Forcing
1

Temperature range of -80°C to +225°C for industrial and military product.
Scope
1

TDS7254B
Bandwidth:2.5GHz, Sampling rate: 20G S/s