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| EQUIPMENT |
Q'TY
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HARDWARE CONFIGURATION | ||||||
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SOC Tester (Agilent 93000) |
1
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Mixed Signal(ADC, DAC, PLL, Analog), Flash, RF, Memory, ATPG, Special I/O(LVDS, PECL, USB2.0, AGP, IEEE1394, I2C, SSTL2, ......) (Data rate: up to 600 MHZ) for SOC product. | ||||||
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SOC Tester (Credence D10) |
1
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Mixed Signal - 4ch AWG / 4ch Digitizer(Max
24bit resolution) 384 Digital Channel (Up to 768 digital pins) 16M vectors / 200Mbps Date rate. |
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| Wafer Probe Station (C/P) |
3
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UF200 – 2 sets; to provide 8", 6" wafer probing service. UF3000 – 1 set; to provide 12", 8" wafer probing service. |
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| VLSI Tester |
9
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D-channel 512 pins / 4M memory / Data rate
50Mhz / Memory Test With Mixed-Mode Testing |
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| Baker |
6
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Max. temperature: 200o / Content: 250Kpcs |
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| Package Handler (F/T) |
10
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| Vacuum Packing |
2
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Wafer, Chip / Die, Package |
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| Lead Scan (ICOS) |
1
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QFP / LQFP / TQFP / TBGA / LBGA / BGA / CSP...Series |
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| Temperature Forcing |
1
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Temperature range of -80°C to +225°C for industrial and military product. |
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| Scope |
1
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TDS7254B |
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