MPW Shuttle Bus Service MPW Overview MPW Service Programs MPW Turnkey Service Flow MPW Turnkey Service Cycle Time Benefits Success Cases MPW Shuttle Bus Schedule

Customer Request Form SOC / ASIC Request Form Gate Array Request Form MPW Request Form Layout Service Request Form COT Request Form

ASIC Product Turnkey Service ASIC Product Turnkey Service SOC/ASIC Turnkey Capability SOC/ASIC Turnkey Equipment Turnkey Background Reliability Test Failure Analysis Package Offerings

Introduction
In the system-on-a-chip (SoC) era, technological path follows the way of many diversified applications and minimize the quantities of each model. Being a state-of-the-art design service provider, testing activities has become an important differential service to other design turnkey service companies. In addition to maximize the level of customer satisfaction, PGC has started the ASIC testing service since 1994. Today, PGC is still the only one SoC/ASIC design service provider owning the in-house testing room between the members of TSMC Design Center Alliance.

PGC's testing service provides our customer a flexible and fast choice comparing to other design service providers. For instance, less quantity of minimum order and less communication cost are the benefits to customers, especially in the post-PC age. PGC believes the best solution is to provide our customers the professional testing service to release the pressure of time-to-market and time-to-production. PGC will continue to invest to maintain the professional testing environment and quality of service.

Testing Environment
The testing environment of PGC is shown as followings：
Clean Room System ： SoC Testing Room
Temperature：21℃( ±1℃)
Humidity：45% ( ±5%)

Capacity
Because PGC owns in-house testing room, we can provide more flexibility to our customer, especially for the requirements of small quantities. PGC's maximum capacity (in-house) is following:
C/P test (Chip Probe or Wafer Sort) capacity: Max. 4,000 wafer pcs./ month
F/T (Final Test) capacity: Max. 4,000K pcs / month

Testing Equipments
The table 1 shows PGC's in-house testing equipments. PGC provides the 'turnkey' testing service from wafer sorting, testing, baking, packing to shipping.

Table-1：Testing equipments list of PGC

EQUIPMENT	Q'TY	HARDWARE CONFIGURATION
SOC Tester　　　(Agilent 93000)	1	Mixed Signal(ADC, DAC, PLL, Analog), Flash, RF, Memory, ATPG, Special I/O(LVDS, PECL, USB2.0, AGP, IEEE1394, I2C, SSTL2, ......)　　　　　　　　(Data rate: up to 600 MHZ) for SOC product.
Wafer Probe Station (C/P)	2	Probe 8", 6" wafer、Ink or map record
VLSI Tester	9	D-channel 512 pins / 4M memory / Data rate 50Mhz / Memory Test With Mixed-Mode Testing
Baker	6	Max. temperature: 200o / Content: 250Kpcs
Package Handler (F/T)	10	1. QFP series / QFN series / LQFP series / TQFP series 2. BGA/CSP series: (27x27 mm)(35x35mm) 3. PLCC series: PLCC-28, 32, 44, 52, 68, 84 4. SOP series: SOP-16, 20, 24, 28, 32 5. DIP series: DIP-20, 24, 28, 48, 64
Vacuum Packing	2	Wafer, Chip / Die, Package
Lead Scan (ICOS)	1	QFP / LQFP / TQFP / BGA ...Series
Temperature Forcing	1	Temperature range of -80°C to +225°C for industrial and military product.
Scope	1	TDS7254B Bandwidth:2.5GHz, Sampling rate: 20G S/s

 

Service and Consulting Items of Testing
PGC provides the accurate SOC (system on a chip) testing solutions & consulting for our customers. There are two major stages for our testing service. One is during the design stage; the other is during the testing stage.
Design stage
Design for testing (DFT service)
Memory BIST service
Boundary scan service
ATPG service
Fault coverage estimation

Testing stage
E/S verification and test program development
DUT board, Load board and probe cards development
Wafer C/P service
IC F/T, Dry Bake & Packing, Shipping service
Process statistical analysis, Yield improvement and Failure analysis service
Reliability test and Quality assurance service
Industrial testing support

Engineering verification and testing flow of PGC
Fig-1 shows the chip verification flow by PGC's testing service. Customers can go mass production after the approval of engineering sample verification. By PGC's testing and turnkey service, customers will increase the flexibility of logistic supports.

Benefits to Customers
A design service company that provides in-house testing service can shorten the testing time, lower the cost, secure the yield rate, and faster the delivery. So PGC established advanced SoC tester Agilent 93000 environment. Now PGC can obviously improve the test capability of high frequency, RF, mixed signal products. This is the biggest difference between PGC and other service companies.

The benefits to our customers are coming from the in-house testing activities. The first, integrated with testing considerations during chip design and verification period can minimize the risk of product development. For example, customers can get the fault coverage estimation earlier. So customers can balance the testing cost and testing coverage level of each project. The second, small quantities supporting becomes more and more important in the SoC projects. Customers want to find a fast, cheap, but small volume solutions for diversified applications. The third, the delivery can be shortened without the outsourcing of testing. The last, the communication cost between designer and testing engineering can be significant decreasing.

According to PGC's professional testing service, Customer can focus on their chip design and marketing activities. PGC will be the best partner with our customer by continuous investment in testing environment and capabilities.

 

Success Cases 90nm 0.13um 0.18um 0.25um 0.35um 0.5um 0.6um

SiP Design Turnkey Service SyStem-in-Package (SiP) SiP Design Platform Service SiP Punch Type Offering SiP versus SOC SiP Package SiP Design Information SiP Package Size SiP Punch Type Offering SiP Sawing Type Offering SiP Developing Time SiP Developing Flow SiP Developing Design Fee Electrical Simulation Thermal Simulation MCM QFP Stacked Die SiP Side by Side SiP Stacked(1) BGA SiP Stacked(2) BGA Package Stacking Package SiP RF Package

About PGC Company Profile(1) Company Profile(2) Business Principles Company Organization Sales Revenue Roadmap Location PGC Market Position Why PGC

Employment 人力資源 公司簡介 公司產品 鏈結104網站

SOC-IP Coming Soon IP Digital IP Mixed Signal Emb-Memory IP Cell & Memory Compiler IP Flash IP Special I/O Gate Array

SOC / ASIC Design Turnkey Service SOC Design Turnkey Service Fault Simulation / Coverage Service Flow SOC RTL Hand-off Flow(SOC RTL-QA) Memory BIST Service Flow SOC RTL-QA Analysis Flow Overview SOC Low Power Service Flow SOC Design Platform Service (RTLQA, STA, DFT and Low Power) FIB Overview SOC Design Platform Service Flow (Between PGC and Customer) FIB Flow Pre-Layout Sign-off Flow ASIC Design Turnkey Service Memo Post-Layout Sign-off Flow PGC ASIC Design Turnkey Service Process Schedule SOC DFT and ATPG Service Flow Mass Production Control Flow Boundary Scan Service Flow Package Offerings

Gate Array Design Turnkey Service 0.35um HDA10000 0.5um HDA9000 0.6um HDA8000 0.6um TGT550 G/A Design Sign-off Flow FPGA->Gate Array conversion FPGA Converting and Verifying Flow