About PGC
PGC (TPEx:8227) was founded in 1991 and is one of Taiwanese top 10 IC design service companies. PGC is a certified member of TSMC Design Center Alliance (DCA) ASIC Service Partner. Headquarters is located in Neihu Technology Park Taipei(Taiwan).
PGC taped-out successfully more than 1000 projects at TSMC and produced several hundred million ICs in 33 years. PGC shipped IC products to hundreds of customers in Europe, USA, Japan, Israel, Korea, Singapore, Vietnam, China and Taiwan. PGC continues making efforts to research and development of ASIC/SoC/IP Platform which is an innovative ASIC design service provider. PGC specializes in the design service of mass production for TSMC 12-inch advanced nm process, including 6nm/3nm node processes, provides TSMC CoWoS advanced package service, and cooperates closely with the high-end IC package company ASE, and also provides Synopsys (IP OEM Program), and others advanced IP service to fulfill the diversified demands of customer targeted applications and especially provide all kinds of Analog IP, Mixed Signal IP, and High Speed Interface IP (MIPI, DDR, PCIe, USB, SerDes, …) to promote competitive advantage of customer’s product.
PGC provides Synopsys (ICC2) IC design turnkey service for TSMC 3nm. PGC is a value-added ASIC design service provider for all customers in advanced technologies.
The applications include
3C products, Industrial Automatic Control, Aerospace, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, CPU, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor, Edge Server, Analog, SiP, Chiplets, High Voltage, ARM, USB, Electric Vehicle, BCD, 3D Package, CoWoS, etc.
Corporate Mission
- Integrity
- Customer Satisfaction
- Trust
- Long-term Partnership
- Excellent Quality
- Evolution
- Innovative Value
- On Demand Service
- Cost-effective
Corporate Organization
Business Model
Business Model
ASIC Turnkey Service
ASIC Technology:
・12"(nm): 3nm,5nm, 6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 110nm, 130nm, Others
・8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others
ASIC Implementation Platform Service
Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII- in, IP Merge, Tape-out, IR Drop, Synthesis, STA, Signal Integrity, APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair, PPA(Power, Performance, Area)
MPW / CyberShuttle Service
CoWoS Turnkey Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service
ARM-based Platform; Andes-base Platform, Others
IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service
PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory；Customized IP, Modify, CPU Hardening
APR Layout Service(ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) / 3D Package Turnkey Service
ASIC Product Turnkey Service(PGC + TSMC + ASE)
Testing Program Development(Credence D10, Chroma 3650, Ytec S1007D,Others), Logistic, WIP, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run, Special Run
IP Portfolio
TSMC Recommend IP Alliance Program,Synopsys IP OEM Program,More and More Customized IP
CPU IP
ARM, ANDES, Others
Digital IP
ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4, 8051, 6502, 16-bits MCU, 32-bits MCU, Others
Mixed Signal IP
ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator, Others
High Speed Interface PHY
USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes, Others
Special I/O IP
I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator, Others
Memory IP
SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM, Others
Analog IP
LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD), Others
Customized IP×PGC IP
Clocking : PLL, DLL, OSC, De-skew, Others
ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope, Others
DAC : Current-mode, Voltage-mode, Others
AFE : PGA, Filter, CDS, Others
Others : LDO, LVDS, POR, VDT, Data Converter, Special I/O, High Speed Interface I/O, Others
Corporate Background
Corporate Background
- CEO: Fred Lai
- Headquarters: 8F., No. 88, Sec. 1, Neihu Rd., Neihu Dist., Taipei City 114, Taiwan (Taipei Neihu Technology Park)
- Founded: August 15, 1991
- Capital: 12M USD (TPEx-listed Company 8227)
- Business Items: ASIC Turnkey Service, Business Partners in Japan, Israel, China, USA, Germany
- Success Story: Successful projects more than 1000 taped-out at TSMC (since 1991)
- Worldwide Customers: Europe, Germany, France, USA, Japan, Israel, Korea, Singapore, Vietnam, China and Taiwan, etc.
Application Areas
Award / Certification
TPEx-listed Company
巨有科技2022.12.20正式挂牌上柜交易 (TPEx: 8227)
The 9th Taiwan Award of Outstanding Small and Medium Enterprises
巨有科技荣获2000年第九届 台湾盘石奖－卓越中小企业
ARM Limited
ARM Technology Access Program(ATAP) Approved Design Center
HDMI
HDMI Adopter Certified
Quality Policy
PGC Quality Certification: ISO9001, QC080000 .
Quality Policy
To maintain the belief of best quality and to pursue the highest satisfaction of customers.
Quality Control Plan
Wafer IQC, Wafer C/P, IC IQC, IC Final Test, ESD Control, FQA, OQC, Packing & Shipping.
Reliability / QA Program
Fab / Assembly
ISO9001
QC080000
HSF（Hazardous Substance Free）
Partner|Complete supply chain and global deployment
Business Partners & Global clients: Europe, Germany, France, the United States, Japan, Israel, South Korea, Singapore, Vietnam, Taiwan and China…etc
TSMC
TSMC DCA (Design Center Alliance) strategy partner
VIS
VIS IC design service strategy partner
ASE
Long-term business relationship for chip package
GTK
Long-term business relationship for chip package
Long-term strategic partner
Synopsys
ANDES
eMemory
M31
Milestone
2010~2023
1999~2009