About PGC

TSMC Design Center Alliance, ASIC Turnkey Service

PGC (TPEx: 8227) was established in 1991 and headquartered in the Neihu Technology Park, Taipei, Taiwan. PGC is a certified member of the TSMC Design Center Alliance (DCA), and specializes in ASIC Turnkey service and CyberShuttle service for TSMC. PGC offers IP service, APR design service, SoC integration service, ASIC design service, and mass production service. PGC has a long-term and close working relationship with TSMC, ASE and Synopsys, successfully completed more than 70 projects annually, and have tape-out over 1000 projects at TSMC. PGC is committed to provide the customers with the highest quality of one-stop turnkey ASIC design service.
PGC specializes in providing design service for TSMC advanced node process, including 6nm and 3nm nodes, as well as advanced packaging services like CoWoS. Additionally, PGC offers design service for VIS’s (Vanguard International Semiconductor) high voltage process (BCD, UHV, HV and SOI technologies). It been working closely with Synopsys on advanced IP solutions (IP OEM Program) for high-speed interface IPs (MIPI, DDR, PCIe, USB, SerDes, Die-to-Die, etc.) to meet the customer’s needs and to enhance the competitiveness of their products and speed up the time to market. PGC provides SoC platform integration based on ARM/ANDES/RISC-V CPU, using the advanced Synopsys (ICC2) IC Design Service Flow which is fully certified for TSMC processes.
In addition, PGC has established a long-term and stable partnerships with worldwide IP providers, particularly in providing analog and mixed signal IPs, as well as customized IP solutions for the customers. PGC is highly experienced in IP integration and verification, and have been continuously pursuing breakthroughs and innovation in the research and development. PGC is playing a pivotal role as the ASIC design service partner for TSMC.

The applications include

3C products, Industrial Automatic Control, Aerospace, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, CPU, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor, Edge Server, Analog, SiP, Chiplets, High Voltage, ARM, USB, Electric Vehicle, BCD, 3D Package, CoWoS, etc.

Corporate Mission

Corporate Organization

Business Model

Business Model

ASIC Turnkey Service

ASIC Technology:
・12"(nm): 3nm,5nm, 6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 110nm, 130nm, Others
・8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others

ASIC Implementation Platform Service

Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII- in, IP Merge, Tape-out, IR Drop, Synthesis, STA, Signal Integrity, APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair, PPA(Power, Performance, Area)

MPW / CyberShuttle Service
CoWoS Turnkey Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service

ARM-based Platform; Andes-base Platform, Others

IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service

PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory;Customized IP, Modify, CPU Hardening

APR Layout Service(ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) / 3D Package Turnkey Service
ASIC Product Turnkey Service(PGC + TSMC + ASE)

Testing Program Development(Credence D10, Chroma 3650, Ytec S1007D,Others), Logistic, WIP, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run, Special Run

IP Portfolio

TSMC Recommend IP Alliance Program,Synopsys IP OEM Program,More and More Customized IP

CPU IP

ARM, ANDES, Others

Digital IP

ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4, 8051, 6502, 16-bits MCU, 32-bits MCU, Others

Mixed Signal IP

ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator, Others

High Speed Interface PHY

USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes, Others

Special I/O IP

I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator, Others

Memory IP

SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM, Others

Analog IP

LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD), Others

Customized IP×PGC IP

Clocking : PLL, DLL, OSC, De-skew, Others
ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope, Others
DAC : Current-mode, Voltage-mode, Others
AFE : PGA, Filter, CDS, Others
Others : LDO, LVDS, POR, VDT, Data Converter, Special I/O, High Speed Interface I/O, Others

Corporate Background

Corporate Background

  • CEO: Fred Lai
  • Headquarters: 8F., No. 88, Sec. 1, Neihu Rd., Neihu Dist., Taipei City 114, Taiwan (Taipei Neihu Technology Park)
  • Founded: August 15, 1991
  • Capital: 13M USD (TPEx-listed Company 8227)
  • Business Items: ASIC Turnkey Service, Business Partners in Japan, Israel, China, USA, Germany
  • Success Story: Successful projects more than 1000 taped-out at TSMC (since 1991)
  • Worldwide Customers: Europe, Germany, France, USA, Japan, Israel, Korea, Singapore, Vietnam, China and Taiwan, etc.

Application Areas

Award / Certification

TPEx-listed Company

巨有科技2022.12.20正式挂牌上柜交易 (TPEx: 8227)

The 9th Taiwan Award of Outstanding Small and Medium Enterprises

巨有科技荣获2000年第九届 台湾盘石奖-卓越中小企业

ARM Limited

ARM Technology Access Program(ATAP) Approved Design Center

HDMI

HDMI Adopter Certified

Quality Policy

PGC Quality Certification: ISO9001, QC080000 .

Quality Policy

Adheres to the belief of quality first and pursues the highest customer satisfaction.

Quality Control Plan

Wafer IQC, Wafer C/P, IC IQC, IC Final Test, ESD Control, FQA, OQC, Packing & Shipping.

Reliability / QA Program

Fab / Assembly

ISO9001

QC080000

HSF(Hazardous Substance Free)

Partner|Complete supply chain and global deployment

Business Partners & Global clients: Europe, Germany, France, the United States, Japan, Israel, South Korea, Singapore, Vietnam, Taiwan and China…etc

TSMC

TSMC DCA (Design Center Alliance) strategy partner

VIS

VIS IC design service strategy partner

ASE

Long-term business relationship for chip package

GTK

Long-term business relationship for chip package

Long-term strategic partner

Synopsys

ANDES

eMemory

M31

Milestone

2024.08

Became the Synopsys IP OEM Program Partner

2024.08

CP, FT Consign Vate

2023.05

Provided TSMC CoWoS(Chip-on-Wafer-on-Substrate)

turnkey service

2022.12

TPEx-listed Company (TPEx: 8227)

2022

Provided TSMC 5nm/6nm/7nm ASIC turnkey service

2021.11

Successfully taped out the first 12nm ASIC project

2021.07

Registered on Taiwan’s Emerging Stock Board

2018~2020

Successfully taped out the first 16mn, 22nm, 28nm ASIC project

2017

Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm process

2016

Successfully taped out the first 40nm low power SoC project

2013

Successfully taped out the first 55nm SoC project

2012

Successfully taped out over 1000 ASIC/SoC projects at TSMC

2010

Successfully taped out the first 65nm ultra low power SoC project

2009

Became ANDES design service partner and Successfully taped out the first 90nm SoC project

2008

Successfully completed SiP ASIC project

2006

Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm process

2003

Qualified as a ARM Approved Design Center

2002

Became the VIS IC design service strategy partner

2001

Became the TSMC DCA (Design Center Alliance) certified strategy partner

2000.09

Received the 9th National Award for Outstanding Small and Medium Enterprises

2000.01

Became an official member of the Taiwan Semiconductor Industry Association
(TSIA)

1999.09

ASIC Testing Factory established. Installed Agilent 93000, Credence D10 and Chroma 3650 testers for High/Low temperature CP and FT tests. Created ASIC testing flows to fully support high production capacity on demand

1999.08

Set up corporate headquarters in Taipei (Neihu Technology Park).

1998

Qualified for the ISO9001, QC080000 certification

1994

Offered TSMC 0.5um/0.35um Gate Array ASIC design service

1993

Adopted Synopsys EDA Design-Flow for TSMC Gate Array & Standard Cell processes.

1992

Became the TSMC ASIC Service strategic partner

1991

PGC ASIC design service company was founded

2010~2023

2023.5

Provide TSMC CoWoS(Chip-on-Wafer-on-Substrate)

turnkey service

2022.12

TPEx-listed Company (TPEx: 8227)

2022

Provide TSMC 5nm、TSMC 7nm ASIC turnkey service

2021.11

Successfully taped out the first 12nm ASIC project

2021

Obtain Taiwan’s Emerging Stock Market registration

2018~2020

Successfully taped out the first 16mn, 22nm, 28nm ASIC project

2017

Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm

2016

Successfully taped out the first 40nm low power SoC project

2013

Successfully taped out the first 55nm SoC project

2012

Over 1000 successful ASIC/SoC projects taped out at TSMC

2010

Successfully taped out the first 65nm ultra low power SoC project

1999~2009

2009
  • ANDES design service partner
  • Successfully taped out the first 90nm SoC project
2008

Successfully accomplished SiP ASIC project

2006

Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm

2003

Qualified as ARM Approved Design Center

2002

VIS IC design service strategy partner

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