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巨有科技 PGC

2025 Design Automation Conference (DAC)
2025/06/23 – 2025/06/25

  • 2025-03-15
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2025/06/11
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2025/07/11 – 2025/07/12
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China 2025 ICCAD
2025/11/20 – 2025/11/21
China 2025 ICDIA
2025/07/11 – 2025/07/12

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  • Solution
    • ASIC Design Service
      • ASIC Implementation Platform Service
      • Embedded Flash Turnkey Service
      • DFT/ATPG Service
      • Low Power Solution
      • FPGA to ASIC Turnkey Service
      • High Voltage Turnkey Service
      • SoC Platform Turnkey Service
    • ASIC Mass Production Service
      • SiP/3D Package Turnkey Service
      • ASE FCBGA/WLCSP/LGA/DRQFN Package Service
      • ASIC Product Turnkey Service
      • Turnkey Testing Solution & Service
      • Failure Analysis
      • Reliability Test
      • Supply Chain Management Service
    • IP Turnkey Service
      • IP Turnkey Service (Portfolio)
      • Synopsys IP OEM Program
      • Cadence IP Alliance
      • M31 IP Alliance
      • TCI Product Matrix
      • ARM Alliance
      • Andes Alliance
      • eMemory Products
      • Interface IP Solutions
      • Synopsys Die-to-Die IP (UCIe)
      • Analog IP Portfolio
      • Analog IP Patent
      • Misc. IPs
    • APR Layout Turnkey Service(ICC2)
    • Gate Array Turnkey Service
    • COT/Foundry Turnkey Service
    • MPW/CyberShuttle Service
    • TSMC CoWoS Turnkey Service
    • TSMC InFO Service
    • Success Projects Overview
  • Investors
    • Financial Information
      • Financial Report
      • Annual Report
      • Monthly Revenue
    • Corporate Organization and Governance
      • Corporate Data
      • Corporate Organization
      • Corporate Governance
    • Stockholders
      • Shareholders Meeting
      • Stockholders Services
      • Earnings Conference
    • Stakeholders
    • FAQ
  • Press Center
  • About PGC
  • Contact Us
  • Careers
  • Language
    • 繁體中文
    • 简体中文
    • English
    • 日本語
  • Solution
    • ASIC Design Service
      • ASIC Implementation Platform Service
      • Embedded Flash Turnkey Service
      • DFT/ATPG Service
      • Low Power Solution
      • FPGA to ASIC Turnkey Service
      • High Voltage Turnkey Service
      • SoC Platform Turnkey Service
    • ASIC Mass Production Service
      • SiP/3D Package Turnkey Service
      • ASE FCBGA/WLCSP/LGA/DRQFN Package Service
      • ASIC Product Turnkey Service
      • Turnkey Testing Solution & Service
      • Failure Analysis
      • Reliability Test
      • Supply Chain Management Service
    • IP Turnkey Service
      • IP Turnkey Service (Portfolio)
      • Synopsys IP OEM Program
      • Cadence IP Alliance
      • M31 IP Alliance
      • TCI Product Matrix
      • ARM Alliance
      • Andes Alliance
      • eMemory Products
      • Interface IP Solutions
      • Synopsys Die-to-Die IP (UCIe)
      • Analog IP Portfolio
      • Analog IP Patent
      • Misc. IPs
    • APR Layout Turnkey Service(ICC2)
    • Gate Array Turnkey Service
    • COT/Foundry Turnkey Service
    • MPW/CyberShuttle Service
    • TSMC CoWoS Turnkey Service
    • TSMC InFO Service
    • Success Projects Overview
  • Investors
    • Financial Information
      • Financial Report
      • Annual Report
      • Monthly Revenue
    • Corporate Organization and Governance
      • Corporate Data
      • Corporate Organization
      • Corporate Governance
    • Stockholders
      • Shareholders Meeting
      • Stockholders Services
      • Earnings Conference
    • Stakeholders
    • FAQ
  • Press Center
  • About PGC
  • Contact Us
  • Careers
  • Language
    • 繁體中文
    • 简体中文
    • English
    • 日本語
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