日期：11/18（二）8:30-16:55
地点：新竹喜来登饭店
巨有科技（PGC）将参加 TSMC OIP 生态论坛 2025，展示涵盖设计、IP 整合、先进封装与量产的一条龙 ASIC Turnkey 服务。焦点包括 AI/HPC 应用、3/4/5/6 nm 制程与多芯片封装技术…等。
解决方案
- ASIC Implementation Platform Service
- IP Turnkey Service (Portfolio)
- Synopsys IP OEM Program
- Cadence IP Alliance
- M31 IP Alliance
- TCI Product Matrix
- ARM Alliance
- Andes Alliance
- eMemory Products
- Interface IP Solutions
- Synopsys Die-to-Die IP (UCIe)
- Analog IP Portfolio
- Analog IP Patent
- Misc. IPs
- Embedded Flash Turnkey Service
- COT/Foundry Turnkey Service
- CyberShuttle/MPW/Prototype Service
- DFT/ATPG Service
- Low Power Solution
- APR Layout Turnkey Service（ICC2）
- FPGA to ASIC Turnkey Service
- High Voltage Turnkey Service
- SiP(System-in-Package) / 3D Package Turnkey Service
- TSMC CoWoS Turnkey Service
- TSMC InFO Service
- ASE FCBGA/WLCSP/LGA/DRQFN Package Service
- SoC Platform Turnkey Service
- ASIC Product Turnkey Service
- Gate Array Turnkey Service
- Turnkey Testing Solution & Service
- Failure Analysis
- Reliability Test
- Supply Chain Management Service
- 成功案例
- 114台北市内湖区内湖路一段88号8楼
- service@pgc.com.tw
- +8862-2658-2233
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