PGC Integrates 2.5D/3D Advanced Packaging Technology to Break the “Memory Wall” and Accelerate AI/HPC ASIC Innovation
2025/10/09
As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory.
Even with continuous improvements in processor performance, if data cannot be delivered in real time, overall system efficiency remains limited.
To overcome this bottleneck, Die-to-Die high-speed interconnect and HBM4/PHY IP integration have emerged as critical technologies for next-generation AI and HPC chip designs.
Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA), leverages its ASIC turnkey expertise and participation in the Synopsys IP OEM Program to deliver advanced design capabilities comparable to leading international players—while offering a more cost-effective, high-value service model that helps global customers accelerate AI and HPC deployment and mass production.
Technical Highlights: Comprehensive Support from Design to Production
- Die-to-Die Interconnect and Chiplet Architecture
- Supports 2.5D/3D integration technologies to enable high-speed, low-latency, and low-power chip-to-chip communication.
- Compliant with UCIe (Universal Chiplet Interconnect Express) standards, ensuring interoperability and scalability for heterogeneous and cross-supply-chain chiplet environments.
- Addresses high-bandwidth demands in chiplet-based systems, empowering flexible multi-die integration.
- HBM4 / PHY IP Integration
- Through Synopsys-certified IP, PGC can rapidly integrate HBM4 memory and PHY interfaces, reducing design cycles and enhancing design reliability.
- Helps design teams overcome bandwidth limitations and achieve terabyte-per-second (TB/s) data throughput.
- TSMC DCA Certification Advantage
- As a TSMC DCA member, PGC provides complete design-to-tape-out support and close collaboration within the TSMC ecosystem.
- Customers can leverage TSMC’s CyberShuttle multi-project wafer program for rapid prototyping and validation, and transition to mass production through PGC’s turnkey services.
- Designs are fully compatible with advanced packaging technologies such as Wafer-on-Wafer (WoW) and 2.5D/3D integration architectures within major foundry ecosystems.
- AI / HPC Application Focus
- The dedicated ASICs can be widely applied to AI accelerators, data center chips, and high-speed network switch devices.
- Designed to support AI training, HPC simulation, and large-scale data processing—meeting the demands of next-generation high-performance computing.
Ecosystem Integration
PGC’s services are closely aligned with TSMC’s advanced foundry ecosystem, combined with Synopsys-certified EDA and IP solutions, to deliver a complete ASIC turnkey flow covering: High-speed interface IP → ASIC design service→ process support → packaging service→ verification → testing → mass production.
In addition to its own testing equipment and validation capabilities, PGC maintains long-term partnerships with multiple advanced test houses, enabling precise analysis for high-frequency, high-speed interface and advanced-node devices.
This level of integration significantly reduces design risk and accelerates time-to-market, while ensuring that the design results are fully compatible with mainstream advanced packaging technologies — such as 2.5D/3D integration and wafer-on-wafer architectures within major foundry ecosystems — as well as international standards including UCIe.
Customer Benefits
PGC emphasizes high reliability, low risk, and rapid time-to-production through its ASIC turnkey services, enabling customers to focus on differentiated design and market innovation by:
- Lowering overall design and ASIC costs;
- Improving design success rates and product stability;
- Providing cross-regional engineering support across Taiwan, Japan, China, and the United States, empowering global AI and HPC deployment strategies.
About Progate Group Corporation
Founded in 1991, Progate Group Corporation (PGC, TPEx: 8227) is a member of the TSMC Design Center Alliance (DCA) specializing in comprehensive ASIC turnkey services, including IP licensing, front-end design, DFT, back-end implementation (APR), testing, and mass production.
PGC is also a member of the Synopsys IP OEM Program, integrating world-class IP resources with advanced process technologies to deliver high-performance, high-reliability ASIC design solutions to global customers.