日期：11/18（二）8:30-16:55
地點：新竹喜來登飯店
巨有科技（PGC）將參加 TSMC OIP 生態論壇 2025，展示涵蓋設計、IP 整合、先進封裝與量產的一條龍 ASIC Turnkey 服務。焦點包括 AI/HPC 應用、3/4/5/6 nm 製程與多晶片封裝技術…等。
解決方案
- ASIC Implementation Platform Service
- IP Turnkey Service (Portfolio)
- Synopsys IP OEM Program
- Cadence IP Alliance
- M31 IP Alliance
- TCI Product Matrix
- ARM Alliance
- Andes Alliance
- eMemory Products
- Interface IP Solutions
- Synopsys Die-to-Die IP (UCIe)
- Analog IP Portfolio
- Analog IP Patent
- Misc. IPs
- Embedded Flash Turnkey Service
- COT/Foundry Turnkey Service
- CyberShuttle/MPW/Prototype Service
- DFT/ATPG Service
- Low Power Solution
- APR Layout Turnkey Service（ICC2）
- FPGA to ASIC Turnkey Service
- High Voltage Turnkey Service
- SiP(System-in-Package) / 3D Package Turnkey Service
- TSMC CoWoS Turnkey Service
- TSMC InFO Service
- ASE FCBGA/WLCSP/LGA/DRQFN Package Service
- SoC Platform Turnkey Service
- ASIC Product Turnkey Service
- Gate Array Turnkey Service
- Turnkey Testing Solution & Service
- Failure Analysis
- Reliability Test
- Supply Chain Management Service
- 成功案例
- 114台北市內湖區內湖路一段88號8樓
- service@pgc.com.tw
- +886-2-2658-2233
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