PGCに関して
TSMC Design Center Alliance, ASIC Turnkey Service
PGC(TPEx:8227)は1991年に設立され、本社は台北市内湖科技園区にあります。 PGC は TSMC Design Center Alliance (DCA)のメンバとして、TSMCのASICターンキーサービス及びCyberShuttleサービスに重点を置き、IPサービス、APR設計サービス、完全なSoC及びASIC設計と量産サービスを提供し、長年にわたって台積電(TSMC)、日月光(ASE)、及び新思科技(Synopsys)と緊密に協力しています。毎年70件以上のプロジェクトを成功裏に完成し、累計で1000件以上のデザインウィン成功案件が(Tape-out)されています。顧客に対して「Turnkey」ワンストップサービスの提供を目指しています。
PGCはTSMCの12インチウェハー最先端 ナノ(nm)プロセス設計サービスを専門とし、TSMCの6nm/3nm及びCoWoSの最先端パッケージ量産サービスを提供しています。また、VISの8インチ ミクロン(um)高圧プロセス(BCD、UHV、HV、SOI)の設計サービスも提供しています。ASE との緊密な連携を行い、さらにSynopsysと協力して、IP OEMプログラムに基づき、高速インターフェースのIPコア(MIPI、DDR、PCIe、USB、SerDes、Die-to-Die など)のソリューションを提供しています。これにより、顧客の製品の多様化に対応し、競争力を強化しています。SoCプラットフォームの提供においては、ARM、ANDES、RISC-Vをコアとして、先端的で完全なSynopsys(ICC2)IC設計サービスフローを使用し、更にSiemens EDAツールも統合して、TSMCプロセスの認証を完全に満たしていました。
さらに、PGCは国内外の多くのIP企業と長期的かつ安定的な協力関係を築いており、特にアナログ(Analog)やミックスド・シグナル(Mixed Signal)IPの提供も顧客向けのカスタマイズIPに関する技術経験を豊富に蓄積しています。また、研究開発技術においては、常に画期的な進歩と革新を追求しており、TSMCのASIC設計サービス業界における先端技術のプロバイダーとなっております。
製品の応用範囲は
3C products, Industrial Automatic Control, Aerospace, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, CPU, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor, Edge Server, Analog, SiP, Chiplets, High Voltage, ARM, USB, Electric Vehicle, BCD, 3D Package, CoWoS などの製品があります。
経営理念
- 言行を一致すること。
- 顧客を満足させること。
- Trust
- Long-term Partnership
- 専業的な品質。
- Evolution
- Innovative Value
- On Demand Service
- Cost-effective


企業の組織
Business Model
Business Model
ASIC Turnkey Service
ASIC Technology:
・12"(nm): 3nm,5nm, 6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 110nm, 130nm, Others
・8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others
ASIC Implementation Platform Service
Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII- in, IP Merge, Tape-out, IR Drop, Synthesis, STA, Signal Integrity, APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair, PPA(Power, Performance, Area)
MPW / CyberShuttle Service
CoWoS Turnkey Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service
ARM-based Platform; Andes-base Platform, Others
IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service
PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory;Customized IP, Modify, CPU Hardening
APR Layout Service(ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) / 3D Package Turnkey Service
ASIC Product Turnkey Service(PGC + TSMC + ASE)
Testing Program Development(Credence D10, Chroma 3650, Ytec S1007D,Others), Logistic, WIP, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run, Special Run
IP Portfolio
TSMC Recommend IP Alliance Program,Synopsys IP OEM Program,More and More Customized IP
CPU IP
ARM, ANDES, Others
Digital IP
ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4, 8051, 6502, 16-bits MCU, 32-bits MCU, Others
Mixed Signal IP
ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator, Others
High Speed Interface PHY
USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes, Others
Special I/O IP
I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator, Others
Memory IP
SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM, Others
Analog IP
LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD), Others
Customized IP×PGC IP
Clocking : PLL, DLL, OSC, De-skew, Others
ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope, Others
DAC : Current-mode, Voltage-mode, Others
AFE : PGA, Filter, CDS, Others
Others : LDO, LVDS, POR, VDT, Data Converter, Special I/O, High Speed Interface I/O, Others
会社概要
会社概要
- 代表者 頼志賢(Fred Lai)社長
- 本社所在地 8F., No. 88, Sec. 1, Neihu Rd., Neihu Dist.,Taipei City, 114, Taiwan (Taipei Neihu Technology Park)
- 設立 1991年8 月
- 資本金 13M USD (TPEx-listed Company 8227)
- 事業項目 ASIC Turnkey Service, Business Partners in Japan, Israel, China, USA, Germany
- 実績 1991年からこれまでTSMCで1000件以上のプロジェクトを成功させました。
- Worldwide Customers: Europe, Germany, France, USA, Japan, Israel, Korea, Singapore, Vietnam, China and Taiwan, etc.
受賞及び認証
TPEx-listed Company
巨有科技2022.12.20正式挂牌上柜交易 (TPEx: 8227)
第九回台湾磐石奨
PGCは2000年第九回台湾磐石奨を受賞
ARM Limited
アーム Limited認証設計サービス資格取得ARM Technology Access Program(ATAP)
HDMI
HDMI Adopter Certified


品質方針
PGC Quality Certification: ISO9001, QC080000 .

パートナー|完全なサプライ チェーンとグローバル展開
Business Partners & Global clients: Europe, Germany, France, the United States, Japan, Israel, South Korea, Singapore, Vietnam, Taiwan and China…etc
TSMC
TSMC DCA (Design Center Alliance) strategy partner
VIS
VIS IC design service strategy partner
ASE
Long-term business relationship for chip package
GTK
Long-term business relationship for chip package
長期的な戦略的パートナー
Synopsys
ANDES
eMemory
M31
Milestone
2024.08
Synopsys IP OEM Program Partner
2024.08
CP, FT Consign Vate
2023.05
Provide TSMC CoWoS(Chip-on-Wafer-on-Substrate)
turnkey service
2022.12
TPEx-listed Company (TPEx: 8227)
2022
Provide TSMC 5nm、TSMC 6/7nm ASIC turnkey service
2021.11
Successfully taped out the first 12nm ASIC project
2021.07
Obtain Taiwan’s Emerging Stock Market registration
2018~2020
Successfully taped out the first 16mn, 22nm, 28nm ASIC project
2017
Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm
2016
Successfully taped out the first 40nm low power SoC project
2013
Successfully taped out the first 55nm SoC project
2012
Over 1000 successful ASIC/SoC projects taped out at TSMC
2010
Successfully taped out the first 65nm ultra low power SoC project
2009
- ANDES design service partner
- Successfully taped out the first 90nm SoC project
2008
Successfully accomplished SiP ASIC project
2006
Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm
2003
Qualified as ARM Approved Design Center
2002
VIS IC design service strategy partner
2001
TSMC DCA (Design Center Alliance) certified strategy partner
2000.09
Awarded 9th National Award of Outstanding Small and Medium Enterprises
2000.01
Joined the Taiwan Semiconductor Industry Association(TSIA) to become a full member.
1999.09
ASIC Testing Factory was established. Install Agilent 93000, Credence D10,and Chroma 3650 testers from CP to FT with High/Low temperature tests. With complete ASIC testing flows and production capacity fully support on demand.
1999.08
Set up corporate headquarters in Taipei (Neihu Technology Park).
1998
Qualified for ISO9001, QC080000 certification
1994
Offered TSMC 0.5um/0.35um Gate Array ASIC design service
1993
Adopted Synopsys EDA Design-Flow for TSMC Gate Array & Standard Cell processes.
1992
Became TSMC ASIC SERVICE strategic partner
1991
The first ASIC design service company, PGC, was founded.
2010~2023
Provide TSMC CoWoS(Chip-on-Wafer-on-Substrate)
turnkey service
TPEx-listed Company (TPEx: 8227)
Provide TSMC 5nm、TSMC 7nm ASIC turnkey service
Successfully taped out the first 12nm ASIC project
Obtain Taiwan’s Emerging Stock Market registration
Successfully taped out the first 16mn, 22nm, 28nm ASIC project
Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm
Successfully taped out the first 40nm low power SoC project
Successfully taped out the first 55nm SoC project
Over 1000 successful ASIC/SoC projects taped out at TSMC
Successfully taped out the first 65nm ultra low power SoC project
1999~2009
- ANDES design service partner
- Successfully taped out the first 90nm SoC project
Successfully accomplished SiP ASIC project
Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm
Qualified as ARM Approved Design Center
VIS IC design service strategy partner