TSMC CoWoS Turnkey Service

CoWoS (Chip on Wafer on Substrate)

• TSMC CoWoS (Chip on Wafer on Substrate) platform leading 2.5D/3D integration solutions for logic process with HBM
• 　．High routing density for interposer
• 　．Lower power consumption
• 　．Smaller form factor

• Business Model
• 　．Turnkey Service (up to shipping)
• 　．Logic top die by TSMC
• 　．3rd-party material (Memory/ Substrate) consigned by customer
• 　．Lid/Ring, chip-cap optional
• Logic + HBM Integration has been the primary driver (also support Logic + Logic)

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