PGC at IC China 2025
Showcasing Comprehensive ASIC Turnkey Service and Advanced Process Expertise
Event Dates｜ November 23 – 25, 2025
Time｜ 09:00 – 16:30
Venue｜ China National Convention Center (CNCC), Beijing
Booth｜ B 205
IC China 2025, China’s premier semiconductor industry event, will take place this November in Beijing. The exhibition gathers global leaders in IC design, wafer manufacturing, packaging and testing, equipment, and materials to explore future innovation and collaboration across the semiconductor ecosystem.
At the exhibition, Progate Group Corporation (PGC) will spotlight its core capability — comprehensive ASIC Turnkey Service — demonstrating how our end-to-end integration from design, simulation, IP integration, process implementation, packaging, to mass production helps customers shorten time-to-market, enhance yield, and reduce risk.
Leveraging our partnership within the TSMC Design Center Alliance (DCA) and extensive ASIC project experience, PGC continues to advance innovation in AI and advanced packaging applications, providing customers with high-performance and highly reliable chip design solutions.
📍 Visit PGC at Booth B 205
Meet our team to learn how PGC’s Turnkey Service model accelerates chip innovation and enables a new generation of competitive semiconductor solutions.
See you in Beijing!