PGCに関して

TSMC Design Center Alliance, ASIC Turnkey Service

PGC(TPEx:8227)は1991年に設立され、30年以上にわたり世界中のお客様に最先端の半導体設計サービスを提供してきました。TSMC Design Center Alliance (DCA)のメンバーとして、ASICターンキー(Turnkey)サービス及びCyberShuttleサービスに注力し、IPライセンシングサービス、APR(自動配置配線)設計サービス、SoC及びASICの設計から量産までをワンストップサービスでサポートしています。

 

PGCはTSMC (台湾積体電路製造)、ASE(日月光半導体製造)、シノプシス株式会社(Synopsys)など業界リーダー企業と緊密に連携し、これまでに累計1000件以上のテープアウト(Tape-out)を成功させてきました。毎年80件を超えるプロジェクトを遂行し、確かな実績を積み重ねています。

 

本社は台北市・内湖科学産業園区にあり、アメリカ、中国、ヨーロッパ、日本、ベトナムなど世界各地に拠点とパートナーを展開しています。PGCはこれからも「ターンキー型のワンストップサービス」で、お客様のイノべーションに伴走します。

製品の応用範囲は

3C products, Industrial Automatic Control, Aerospace, RF, Security, Storage, IoT, AI, MEMS, Networking, Automotive, Factory Automation, PLC, Medical, HPC, GPS, Communication, ADAS, FPGA, Multimedia, Smart meter, ASIC, IP Camera, 5G, CPU, Data Center, Machine Learning, AIoT, Image Processing, Biomedical, Edge Computing, Cloud Server, AR, VR, Drone, SoC, Edge AI, Sensor, Edge Server, Analog, SiP, Chiplets, High Voltage, ARM, USB, Electric Vehicle, BCD, 3D Package, CoWoS, Robot などの製品があります。

経営理念

企業の組織

Business Model

Business Model

ASIC Turnkey Service

ASIC Technology:
・12"(nm): 3nm,5nm, 6nm, 7nm, 12nm, 16nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 110nm, 130nm, Others
・8"(um): 0.11um, 0.13um, 0.15um, 0.18um, 0.25um, 0.35um, 0.5um, Others

ASIC Implementation Platform Service

Spec-in, FPGA-in, RTL(Verilog, VHDL)-in, Netlist-in, GDSII- in, IP Merge, Tape-out, IR Drop, Synthesis, STA, Signal Integrity, APR Layout, Low Power Design, Power Domain, Clock Domain, DFT, ATPG, JTAG, BSD, Mem_BIST, IP_BIST, IBIS, LVS, DRC, Verification, Memory ECC, Memory Repair, PPA(Power, Performance, Area)

MPW / CyberShuttle Service
CoWoS Turnkey Service
Gate Array Turnkey Service
FPGA To ASIC Turnkey Service
Embedded Flash Turnkey Service
High Voltage Turnkey Service
SoC Platform Turnkey Service

ARM-based Platform; Andes-base Platform, Others

IP(Special I/O, High Speed Interface I/O, Mixed Signal, High Density Memory, Flash...) Design Service

PLL, Special I/O, High Speed Interface I/O, ADC & DAC, High Density Memory;Customized IP, Modify, CPU Hardening

APR Layout Service(ICC2)
COT / Foundry Turnkey Service
SiP(System-in-Package) / 3D Package Turnkey Service
ASIC Product Turnkey Service(PGC + TSMC + ASE)

Testing Program Development(Credence D10, Chroma 3650, Ytec S1007D,Others), Logistic, WIP, CP, FT, MP, Package, Testing, Yield Improvement, Corner Run, RMA, Failure Analysis, Reliability, Wafer Allocation, Hot Run, Super Hot Run, Special Run

IP Portfolio

TSMC Recommend IP Alliance Program,Synopsys IP OEM Program,More and More Customized IP

CPU IP

ARM, ANDES, Others

Digital IP

ARM, ANDES, Cortex, WDC, UART, JPEG, H.264, H.265, 10/100/1000 MAC, USB2.0/USB3.0/USB3.1 Controller, DDR2/DDR3/DDR4, 8051, 6502, 16-bits MCU, 32-bits MCU, Others

Mixed Signal IP

ADC, DAC, Codec, PLL, Crystal Oscillator, LDO, POR, Bandgap, Voltage Regulator, Others

High Speed Interface PHY

USB2.0/USB3.0/USB3.1, DDR2/DDR3/DDR4, SATAI/II/III, PCIe, HDMI, XAUI, MIPI, SerDes, Others

Special I/O IP

I2C, 1394a IO, LVDS, PECL, SSTL-2, SSTL-18, SSTL-15, USB2.0/USB3.0/USB3.1, HSTC, PCI-X, 32K Crystal Oscillator, Others

Memory IP

SRAM, ROM, Flash, OTP, MTP, FUSE, EEPROM, Others

Analog IP

LDO, Buck/Boost PWM converter, PFC(Mixed/HV/BCD), Others

Customized IP×PGC IP

Clocking : PLL, DLL, OSC, De-skew, Others
ADC : PiPelined, SAR, Cyclic, Delta-sigma, Single-slope, Others
DAC : Current-mode, Voltage-mode, Others
AFE : PGA, Filter, CDS, Others
Others : LDO, LVDS, POR, VDT, Data Converter, Special I/O, High Speed Interface I/O, Others

会社概要

会社概要

  • 代表者 頼志賢(Fred Lai)社長
  • 本社所在地 8F., No. 88, Sec. 1, Neihu Rd., Neihu Dist.,Taipei City, 114, Taiwan (Taipei Neihu Technology Park)
  • 設立 1991年8 月
  • 資本金 13M USD (TPEx-listed Company 8227)
  • 事業項目 ASIC Turnkey Service, Business Partners in Japan, Israel, China, USA, Germany
  • 実績 1991年からこれまでTSMCで1000件以上のプロジェクトを成功させました。
  • Worldwide Customers: Europe, Germany, France, USA, Japan, Israel, Korea, Singapore, Vietnam, China and Taiwan, etc.

応用分野

受賞及び認証

TPEx-listed Company

巨有科技2022.12.20正式挂牌上柜交易 (TPEx: 8227)

第九回台湾磐石奨

PGCは2000年第九回台湾磐石奨を受賞

ARM Limited

アーム Limited認証設計サービス資格取得ARM Technology Access Program(ATAP)

HDMI

HDMI Adopter Certified

品質方針

PGC Quality Certification: ISO9001, QC080000 .

Quality Policy

To maintain the belief of best quality and to pursue the highest satisfaction of customers.

Quality Control Plan

Wafer IQC, Wafer C/P, IC IQC, IC Final Test, ESD Control, FQA, OQC, Packing & Shipping.

Reliability / QA Program

Fab / Assembly

ISO9001

QC080000

HSF(Hazardous Substance Free)

パートナー|完全なサプライ チェーンとグローバル展開

Business Partners & Global clients: Europe, Germany, France, the United States, Japan, Israel, South Korea, Singapore, Vietnam, Taiwan and China…etc

TSMC

TSMC DCA (Design Center Alliance) strategy partner

VIS

VIS IC design service strategy partner

ASE

Long-term business relationship for chip package

GTK

Long-term business relationship for chip package

長期的な戦略的パートナー

Synopsys

ANDES

eMemory

M31

Milestone

2025.02

Successfully taped out the first 6nm ASIC project

2024.08

Synopsys IP OEM Program Partner

2024.08

CP, FT Consign Vate

2023.05

Provide TSMC CoWoS(Chip-on-Wafer-on-Substrate)

turnkey service

2022.12

TPEx-listed Company (TPEx: 8227)

2022

Provide TSMC 5nm、TSMC 6/7nm ASIC turnkey service

2021.11

Successfully taped out the first 12nm ASIC project

2021.07

Obtain Taiwan’s Emerging Stock Market registration

2018~2020

Successfully taped out the first 16mn, 22nm, 28nm ASIC project

2017

Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm

2016

Successfully taped out the first 40nm low power SoC project

2013

Successfully taped out the first 55nm SoC project

2012

Over 1000 successful ASIC/SoC projects taped out at TSMC

2010

Successfully taped out the first 65nm ultra low power SoC project

2009

  • ANDES design service partner
  • Successfully taped out the first 90nm SoC project

2008

Successfully accomplished SiP ASIC project

2006

Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm

2003

Qualified as ARM Approved Design Center

2002

VIS IC design service strategy partner

2001

TSMC DCA (Design Center Alliance) certified strategy partner

2000.09

Awarded 9th National Award of Outstanding Small and Medium Enterprises

2000.01

Joined the Taiwan Semiconductor Industry Association(TSIA) to become a full member.

1999.09

ASIC Testing Factory was established. Install Agilent 93000, Credence D10,and Chroma 3650 testers from CP to FT with High/Low temperature tests. With complete ASIC testing flows and production capacity fully support on demand.

1999.08

Set up corporate headquarters in Taipei (Neihu Technology Park).

1998

Qualified for ISO9001, QC080000 certification

1994

Offered TSMC 0.5um/0.35um Gate Array ASIC design service

1993

Adopted Synopsys EDA Design-Flow for TSMC Gate Array & Standard Cell processes.

1992

Became TSMC ASIC SERVICE strategic partner

1991

The first ASIC design service company, PGC, was founded.

2010~2023

2023.5

Provide TSMC CoWoS(Chip-on-Wafer-on-Substrate)

turnkey service

2022.12

TPEx-listed Company (TPEx: 8227)

2022

Provide TSMC 5nm、TSMC 7nm ASIC turnkey service

2021.11

Successfully taped out the first 12nm ASIC project

2021

Obtain Taiwan’s Emerging Stock Market registration

2018~2020

Successfully taped out the first 16mn, 22nm, 28nm ASIC project

2017

Adopted Synopsys (ICC2) Design-Flow for TSMC 5nm

2016

Successfully taped out the first 40nm low power SoC project

2013

Successfully taped out the first 55nm SoC project

2012

Over 1000 successful ASIC/SoC projects taped out at TSMC

2010

Successfully taped out the first 65nm ultra low power SoC project

1999~2009

2009
  • ANDES design service partner
  • Successfully taped out the first 90nm SoC project
2008

Successfully accomplished SiP ASIC project

2006

Adopted Synopsys (ICC1) Design-Flow for TSMC 40nm

2003

Qualified as ARM Approved Design Center

2002

VIS IC design service strategy partner

すぐにご連絡ください

Scroll to Top